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DEMI 400 Series

DEMI 400The PostProcess™ DEMI 400™ Series Support & Resin Removal submersion solutions deliver automated removal of PolyJet and FDM supports and excess resin for SLA, CLIP, and DLP technologies. All versions in the DEMI 400 Series includes PostProcess’ patented Submersed Vortex Cavitation (SVC) technology – the system uses a rotating motion while the part is immersed in fluid and ensures even exposure to the induced mechanical agitation. Utilizing the proprietary software and paired with PostProcess’ exclusive detergents, the right amount of time, and exact temperature based on the material and geometry of the 3D printed part, the DEMI 400 delivers precise, hands-free post-printing for additive manufacturing workflows.

Click to download the DEMI 400 Series PDF Specifications.